|
|
| FEI Quanta 200 3D Focused Ion Beam System |
|
The Quanta 200 3D offers significant
benefits over conventional ion beam milling systems, including built-in imaging
capabilities and sample handling.
For more information see the FEI website.
|
Specifications
| Capabilities |
Milling
and deposition on sub-micron scale
Secondary ion or electron imaging
Mill or deposite user defined patterns
Chemically enhanced etching of polymers, diamond, oxides
and metals
TEM sample
prep
Device modification
and fabrication
Integrated
circuit failure analysis
Deposition
of metals and insulators |
| Ion Source |
Gallium liquid metal ion source |
| Accelerating
Voltage |
Electron optics: 200V-30kV Ion Optics: 5
- 30 kV |
| Magnification |
800,000X
max |
| Beam
Current |
Electron Optics: 1uA Ion Optics: 20
nA |
| Image
Reso9lution |
Electron Optics: 3.5
nm @ 30kV Ion Optics: 10nm@30kV@1pA |
| Scanning
Area |
1.8mm x 1.8mm (max.)
for eucentric stage |
| Vacuum Modes |
High Vacuum
Low Vacuum
Environmental SEM
|
| Specimen
Considerations |
Conductor, Semiconductor, Insulator, biological, ploymer,
textile, etc.
|
| Features |
Digital
Image Capture
In-Situ Lift Out Microsampling
|
| |
|
|
Last updated
February 29, 2008
|
