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Much
of the program activity is taking place in the dedicated WMTRP laboratory.
This laboratory contains a machining area, analytical area, and
offices. It houses a
rotating disk wear
tester, precision tool grinder, planer, spindle vibrational analysis
facility, and
surface roughness measurement system, as well as the microscopy and
image analysis facilities. The
spindle vibrational analysis facility includes numerous
high-speed spindles
and controllers, mechanical shakers, balancing equipment, and
associated
instrumentation. In addition, a specially designed belt sanding machine,
instrumented with power
and vibration sensors, was built for WMTRP abrasive
machining research. The microscopy facility includes a video optical microscope
capable of
500X magnification. The images can be stored in digital format in the
microscope or
downloaded to the computer for analysis.
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