Presenter: Jian Xu
Advisor(s): Paul D. Franzon
Author(s): Jian Xu
Graduate Program: Electrical Engineering
Title: Development of AC Coupled Interconnects for Multi-Gigabit/sec Inter-chip Communications
Abstract: AC coupled interconnects (ACCI), including capacitive coupling and inductive coupling schemes, provide non-contacting signal channels for high-speed inter-chip communications. Researchers in Prof. Paul Franzonís group are exploring the applications of ACCI on high-density chip packaging and three-dimensional integrated circuit (3D-IC). This poster shows the overview of ACCI project and presents three demonstration systems for capacitively coupled chip-to-chip communications as well as inductively coupled vertical signaling in 3D-IC: (1) two flip-chips on a multi-chip module (MCM) communicate at 2.5 Gigabit/sec data rate via chip-substrate interfacing capacitor over a 5.7cm lossy transmission line; (2) two bare-chips on a print circuit board (PCB) communicate at 2.0 Gigabit/sec data rate via on-chip embedding capacitors over a 17cm copper trace; (3) two stacked chips with 90um thickness communicate at 2.8 Gigabit/sec data rate via an inter-chip transformer and tolerate 50um misalignment.